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  • Advanced solutions for high vacuum sputter deposition processes

Advanced solutions for high vacuum sputter deposition processes

  • Presenting our advanced UHV Systems for Sputtering Deposition

    Standalone UHV magnetron sputtering systems dedicated to accurate and reproducible thin film layer deposition. Configuration options to allow sputtering from both magnetic and non-magnetic target materials alike.
  • UK Surface Analysis Forum Henniker Scientific Event 2020


    A quick-change bottom-mounted source flange that can be rapidly removed to either reconfigure sources or perform maintenance procedures. The source flange is available in a wide range of standard configurations with all sputtering sources or combinations of sputtering and thermal evaporation sources. Sample stages can be supplied in various sizes and with a range of heating and cooling options.

    Transferring system:

    The chamber is equipped with a large, easy-access vacuum door which is dual Viton sealed with differential pumping in the seal interspace. This maintains an excellent base pressure whilst providing perfect internal access.

    Wafers for sample up to 3’’ with different shapes.

    For further information please visit our dedicated product page here. 
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