Plasma Cleaning of Silicon Wafers
Influence of Surface Roughness on the Dynamics and Crystallization of Vapor-Deposited Thin Films
Surface cleanliness is often the first step in the experimental study of new materials and methods. In this recent article from the University of Silesia
, the Henniker HPT-100 Plasma Cleaner is used to remove trace organic contamination from the surface of silicon wafers that are utilised in substrate roughness studies relating to the vapor deposition of Ultra-Stable Glass (USG) which has applications in the fabrication of light-emitting diodes and organic field-effect transistors.