Magnetron Sputtering Source
Magnetron Sputtering Source
The MS2 63C1 is a UHV compatible 2-inch Magnetron Sputtering Source providing excellent uniformity and target utilisation.
The MS2 63C1 magnetron sputtering source can be used with DC, pulsed DC, and RF power supplies and can accommodate both magnetic and non-magnetic materials, where the modular magnetic array is designed to maintain the balanced mode of operation.
The integrated in-situ tilt mechanism, which is operable from the airside, allows maximum flexibility in both standard and custom chamber geometries and the domed shutter mechanism ensures maximum use of the available space in the chamber.
Options
- Mass Flow Controller Integration (with M600DC power supply)
- Z manipulator
Request a quotation or further information
Other Features
Features
- Mounting flange: DN 63 CF
- In-situ tilt range: +45° to -10°
- Chimney as standard
- Pneumatic dome-type shutter
Targets:
- Diameter: 2"
- Thickness | non-magnetic: 1-6 mm
- Thickness | magnetic: Fe 1 mm, Co 2-3 mm, Ni 2 mm
- Indirectly cooled
Technical Data
Magnetron Source
|
Mounting flange |
DN 63 CF * |
Max. power (DC mode) |
400 W DC ** |
Max. power (RF mode) |
400 W RF ** |
Max. voltage DC |
1200 V |
Connector DC/RF |
type 7/16 |
Target
- form
- diameter
- thickness
- cooling
|
- circular
- 2" (50.8 mm) ± 0.2 mm
- 1 - 6 mm
- indirect
|
Water flow |
min. 1l/min |
Max. inlet water temperature |
< 28 °C |
Max. water pressure |
3 bar |
Tubing diameter |
Ø6×1 mm PTFE |
Magnet material |
Neodymium Iron Boride (NdFeB) |
Magnet max. temperature |
200 °C |
Internal pneumatic shutter |
yes - dome type shutter |
Insitu tilt module |
yes, range +45° to -10° |
Chimney |
Yes |
Typical rates
- Cu, 140 mm distance
- Ti, 140 mm distance
|
- 45 nm/min @ 300 W
- 30 nm/min @ 300 W
|
Internal gas inlet |
yes (VCR standard) |
Working gas |
Ar |
Max. working pressure |
5×10-3 - 1×10-1 mbar |
Optimal working pressure |
5×10-3 - 5×10-2 mbar |
* Other mounting flange on request (DN 100 CF, DN 160 CF). ** The maximum power is determined by the target material. |