Magnetron Sputtering Source

The MS2 63C1 is a UHV compatible 2-inch Magnetron Sputtering Source providing excellent uniformity and target utilisation.

The MS2 63C1 magnetron sputtering source can be used with DC, pulsed DC, and RF power supplies and can accommodate both magnetic and non-magnetic materials, where the modular magnetic array is designed to maintain the balanced mode of operation.

The integrated in-situ tilt mechanism, which is operable from the airside, allows maximum flexibility in both standard and custom chamber geometries and the domed shutter mechanism ensures maximum use of the available space in the chamber.

Options

Mass Flow Controller Integration (with M600DC power supply)
Z manipulator

Request a quotation or further information

Other Features

Features

Mounting flange: DN 63 CF
In-situ tilt range: +45° to -10°
Chimney as standard
Pneumatic dome-type shutter

Targets:
Diameter: 2"
Thickness | non-magnetic: 1-6 mm
Thickness | magnetic: Fe 1 mm, Co 2-3 mm, Ni 2 mm
Indirectly cooled

Technical Data

Magnetron Source
Mounting flange	DN 63 CF *
Max. power (DC mode)	400 W DC **
Max. power (RF mode)	400 W RF **
Max. voltage DC	1200 V
Connector DC/RF	type 7/16
Target form diameter thickness cooling	circular 2" (50.8 mm) ± 0.2 mm 1 - 6 mm indirect
Water flow	min. 1l/min
Max. inlet water temperature	< 28 °C
Max. water pressure	3 bar
Tubing diameter	Ø6×1 mm PTFE
Magnet material	Neodymium Iron Boride (NdFeB)
Magnet max. temperature	200 °C
Internal pneumatic shutter	yes - dome type shutter
Insitu tilt module	yes, range +45° to -10°
Chimney	Yes
Typical rates Cu, 140 mm distance Ti, 140 mm distance	45 nm/min @ 300 W 30 nm/min @ 300 W
Internal gas inlet	yes (VCR standard)
Working gas	Ar
Max. working pressure	5×10^-3 - 1×10^-1 mbar
Optimal working pressure	5×10^-3 - 5×10^-2 mbar
* Other mounting flange on request (DN 100 CF, DN 160 CF). ** The maximum power is determined by the target material.

Magnetron Sputtering Source